Abstract：A simple experimental technique is presented for measuring yield stress of magnetron sputtered aluminum thin film by combining the curvature and sphere-tip nanoindentation technology. The mechanical model of spherical indentation is established，finite element simulations are conducted，Aluminum film with a thickness of approximately 1 μm is deposited on silicon wafer substrate by a DC magnetron sputtering system，both curvature and nanoindentation tests are carried out on the Al film/Si substrate system，and the yield stress of Al film is measured to be 371 MPa by least square curve fitting of the indentation data. This method can also be used to study the mechanical properties of other thin films and small volume materials.
2016, Vol. 37 
