Abstract：In microelectronic package, thermal warping deformation caused by the mismatch of the thermal expansion coefficient between chips and substrates is a main reason for the failure of chip package structures. In this paper, the chip package structure is simplified into a heterogeneous stepped double-layer plate model, and the thermal warping deformation is calculated using the finite element method during heating. The thermal warping deformation is also measured using three-dimensional digital image correlation (DIC) to verify the simulation results. Furthermore, a thermal warping control method based on the frame substructure is proposed, and it has been proven effective by using finite element method and experimental methods. The influence of geometric parameters such as the thickness and width of the frame, as well as material parameters like elastic modulus and thermal expansion coefficient on the thermal warping control effect, is discussed in detail. The research results show that the thermal warping deformation measured by DIC technology is in agreement with the simulation results. The warping control method using the frame substructure can effectively reduce the thermal warping deformation of the heterogeneous stepped double-layer plate structure. The thermal expansion coefficient, width, and thickness of the frame have a significant impact on the thermal warping deformation, while the elastic modulus has a relatively minor effect.
2025, Vol. 46 
