Abstract：With the development of engineering technology and materials science, pure elastic materials can no longer meet the application needs of materials in industrial manufacturing. Magneto-electro-elastic (MEE) materials have a more complex internal structure compared to classical elastic materials, and the methods for solving mechanical and physical performance are more difficult compared to classical elastic materials. Therefore, the mode III fracture behavior of MEE materials with nano-defect (pores and cracks) is investigated in this paper. Based on the Gurtin-Murdoch surface theory and conformal mapping theory, the mode III fracture properties of the MEE materials containing an arbitrary location through-crack emanating from a nano-hole under anti-plane mechanical load, in-plane electrical load and in-plane magnetic load are studied. The accurate solution of the MEE field in the matrix was obtained by using the MEE theory and the far-field load conditions. The analytical expression of the MEE field intensity factors of the tips at both ends of the through-crack under the condition that the surface of the nano-defect are magnetoelectric impermeable are given. The comparison between the obtained results and existing research demonstrates the correctness of the proposed method. The effects of the crack location, crack interaction, and the application of multiple physical loads on the dimensionless MEE field strength factors were discussed. The results show that the dimensionless MEE field intensity factors exhibits a significant size effect. The surface effect of the nano-defects on the MEE tip fields of the cracks is constrained by the crack location. The dimensionless MEE field intensity factors are significantly affected by the ratio of crack length of the through-crack and the applied MEE loads. The results obtained in this article provide a theoretical basis for the experiments and numerical simulations of the mode III fracture behavior of an arbitrary location through-crack emanating from a nano-hole in MEE materials.
2024, Vol. 45 
