Abstract：The mismatch of force/thermal performance between the chip and packaging substrate during the electronic packaging interconnection, as well as the vibration, drop and impact suffered by the electronic products during the service are easy to cause the shear deformation of conductive adhesive interconnection layer to different degrees and even the adhesive interconnection failure. Effective characterization of the rate-dependent shear behavior of electronic interconnection conductive adhesive is an important foundation of the reliability research on adhesive interconnection packaging structure. The effective acquisition of rate-dependent shear behavior of conductive adhesive interconnection layer is different from that of the traditional metal/alloy materials. In this study, research on the shear test and characterization under different loading rates of the double-shear overlapping copper specimen interconnected with conductive adhesive (50wt.% Ag, 60wt.% Ag) were carried out by the Instron universal material testing machine and split Hopkinson pressure bar device (SHPB), the waveform shaping of SHPB incident wave were performed to ensure the stress equilibrium and uniform deformation state of specimen at constant strain rate within a certain time frame before and after shear failure of adhesive interconnection layer. The shear failure mode of conductive adhesive interconnection specimen under different working conditions and the acquisition method of adhesive interconnection shear strain/strain rate eliminating the elastic deformation effect of overlapping copper were provided. The effects of loading rate and conducting particles on adhesive interconnection shear deformation behavior and shear strength were analyzed. The adhesive interconnection shear strain/strain rate after eliminating the elastic deformation of overlapping copper is relatively small, and the adhesive interconnection shear under different working conditions mainly shows adhesive failure mode. The adhesive interconnection shear strength with lower silver content is relatively higher under quasi-static loading, while opposite under dynamic loading. Research results are of great significance to the efficient application of conductive adhesive in electronic industry and the effective characterization of shear behavior of adhesive interconnection structures.
2023, Vol. 44 
