Abstract：This paper presents a algorithm for electromigration (EM) failure analysis based on ANSYS Multi-physics commercial software and FORTRAN codes with considering multiple driving migration mechanisms. The electromigration sensitivity analysis equation and the corresponding numerical algorithm are also proposed. The sensitivity analysis for solder joints is implemented when the involved EM sensitivity design variables are the activation energy, the initial self-diffusion coefficient and mechanical properties of the material parameters. Furthermore, the EM simulation for CSP structure is performed to get failure lifetime based on the full factorial design of experiments (DOE) by using 3D finite element analysis.
2011, Vol. 32 
