Abstract：The superior electrical and mechanical properties of flexible electronics enables the breading of the limitations of traditional electronic devices, and promises wide applications in the fields of bionic electronics and medical monitoring. Transfer printing is the mainstream technology for the fabrication of flexible electronics, realizing the process of picking up electronic devices from the donor substrate and printing them onto the receiver substrate. The existing transfer printing process has problems such as complex stamp preparation or damage to electronic devices caused by external excitation, which greatly limits the application of transfer printing. In this paper, a load-combination modulation-based transfer printing method is proposed to control the loading sequences for the rigid pillars on the stamp, modulate the displacement/stress distribution at the stamp/device interface, realize the interface adhesion control, and finally complete the transfer printing on different rigid/flexible substrates. Based on the theoretical model and finite element analysis, the nonlinear relationship between the geometric parameters and the energy release rate of the stamp in the transfer printing process is explored to provide a guidance for the stamp design in transfer printing. Physical experiments show that the transfer printing method not only has a high compatibility with the morphology of electronic devices and receiver substrates, but also supports the large-scale, multi-layer and multi-time integration of micro-silicon wafers on flexible substrates.
2025, Vol. 46 
