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| Dynamic analysis of the buckled thin film in island-interconnector structure under thermal effect |
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Abstract The flexible electronic devices based on the island-interconnector structure have been used in health monitoring and skin electronics. However, flexible electronic devices are extremely affected to vibration caused by changes in operating temperature during operation, which in turn affect the sensitivity and reliability of the device. Therefore, this paper studies the dynamic behaviours of the buckled thin films which serve as interconnects in island-interconnector structure flexible electronic devices under the thermal effect. Firstly, the dynamic equations of the buckled thin films under thermal effect are derived based on the Euler-Bernoulli beam theory. Secondly, by introducing new variables, the dynamic equations are introduced into the Hamilton system, and the corresponding Hamilton regular equations are obtained. Then, the symplectic Runge-Kutta method is used to solve the Hamilton regular equations. Compared with the traditional Runge-Kutta method, the symplectic algorithm has the advantages of high precision and high numerical stability in solving nonlinear dynamic equations. Finally, the effects of temperature change, pre-strain, and damping coefficient on the dynamic response of the buckled thin film are analyzed. This study would provide a theoretical reference for the dynamic design of flexible electronic devices.
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Received: 12 November 2020
Published: 21 October 2021
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Corresponding Authors:
Bo Wang
E-mail: bowang@nwpu.edu.cn
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2021, Vol. 42 
