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| STUDY ON BONDING RELIABILITY OF ELECTRICALLY CONDUCTIVE |
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Abstract Electrically conductive adhesive (ECA) bonding is a kind of new packaging technology developed in recent years and its reliability is crucial for the stable operation of ECA bonding assembly. Based on the failure modes of ECA joints, the mechanical properties of Anisotropic Conductive Film (ACF) are introduced and the effects of mechanical loading, environmental factors and properties of the components on the reliability of ECA joints are reviewed in the paper. Theoretical analysis of the contact resistance, bonding strength and failure probability of ECA is presented. Additionally the interfacial residual stress and fatigue life of ECA joints are discussed. Finally, the future researches are proposed for reliability of ECA joints.
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Received: 02 December 2010
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2010, Vol. 31 
