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| A New Algorithm for Electromigration Failure Analysis of Metal Interconnects |
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Abstract This paper presents a new algorithm for electromigration (EM) failure analysis based on ANSYS Multi-physics commercial software and FORTRAN codes with considering the four driving forces mechanism which includes the electron wind force, temperature gradient, stress gradient, as well as atomic density gradient. The electric-thermal-structural coupled analysis based on ANSYS multi-physics simulation platform is performed to obtain the current density distribution, the temperature distribution and stess distribution of analysis model. EM atomic density redistribution algorithm is then developed using FORTRAN code to get atomic density distribution of different time. The dynamic simulation of EM void evolution is performed to get failure lifetime based on the criterion of void incubation and propagation. Finally, the comparisons of voids generation through numerical example of SWEAT and CSP structure with the measurement results are discussed.
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Received: 18 November 2008
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2010, Vol. 31 
