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| STUDY ON SOLDER/IMC INTERFACE DELAMINATION OF PBGA BASED ON CZM METHOD |
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Abstract In the reliability analysis of PBGA, Cohesive zone model (CZM) was introduced to study the interface delamination crack between solder and IMC of PBGA under thermal cycling through ANSYS software. The simulation considered the influence of Intermetallic compounds (IMC) which produced between the interface of SnAgCu solder and copper in the process of encapsulation. The results show that the solders of electronic packages under the higher stress and strain in the thermal cycling, and the outside of solders which far from the center under bigger stress and strain than the inside ones. The existence of IMC greatly reduced the reliability of solder. Interface delamination crack occurred at two ends of the interface between IMC and solder in the outside of the solder joints, and gradually extended to the interior with the increase of cycles. In front phases of the thermal cycles, the maximum damage on each interface increased quickly, and tended to be stable gradually with the increase of cycles. The damage of interface of the NO.4 solder is always the biggest in the whole process.
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Received: 08 July 2013
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Corresponding Authors:
Junhong Wei
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2014, Vol. 35 
